Selected Publications
- A.S. Budiman, H-A.-S. Shin, B.-J. Kim, S.-H. Hwang, H.-Y. Son, M.-S. Suh, Q.-H. Chung, K.-Y. Byun, N. Tamura, M. Kunz, Y.-C. Joo. Measurements of Stresses in Cu and Si around Through-Silicon Via by Synchrotron X-Ray Microdiffraction for 3-Dimensional Integrated Circuits. Microelectron. Rel. 52, p. 530-533, 2012
- A. S. Budiman, S. M. Han, Q. Wei, P. Dickerson, N. Tamura, M. Kunz, A. Misra. Plasticity in the Nanoscale Cu/Nb Single Crystal Multilayers as Revealed by Synchrotron X-Ray Microdiffraction.J. Mater. Res. 27, p. 599-611, 2012
- A. S. Budiman, G. Lee, M. J. Burek, D. Jang, S. M. Han, N. Tamura, M. Kunz, J. R. Greer, T. Y. Tsui. Plasticity of Indium Nanostructures as Revealed by Synchrotron X-Ray Microdiffraction. Mater. Sci. Eng. A 538, p. 89-97,2012
- A. S. Budiman, N. Li, J. K. Baldwin, J. Xiong, H. Luo, Q. Wei, N. Tamura, M. Kunz, K. Chen, A. Misra. Growth and Structural Characterization of Cu/Nb Single Crystal Multilayers for in situ Synchrotron Laue X-Ray Microdiffraction Studies. Thin Solid Film 519, p. 4137-4143, 2011
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- A. S. Budiman, P. R. Besser, C. S. Hau-Riege, A. Marathe, Y. -C. Joo, N. Tamura, J. R. Patel and W. D. Nix. Electromigration-induced Plasticity: Texture Correlation and Implications for Reliability Assessment. J. Electron. Mater.38, iss. 3, p.379-391, 2009. (J.E.M. Editor’s Choice Paper)
- A. S. Budiman, S. M. Han, J. R. Greer, N. Tamura, J. R. Patel and W. D. Nix. A Search for Evidence of Strain Gradient Hardening in Au Submicron Pillars under Uniaxial Compression Using Synchrotron X-Ray Microdiffraction. Acta Mater.,56, p. 602-608, 2008
- A. S. Budiman, N. Tamura, B. C. Valek, K. Gadre, J. Maiz, R. Spolenak, W. D. Nix and J. R. Patel. Crystal Plasticity in Cu Damascene Interconnect Lines Undergoing Electromigration As Revealed by Synchrotron X-Ray Microdiffraction. App. Phys. Lett., 88, p. 233515, 2006
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