Qi Ge

Qi Ge

Assistant Professor

Research Interests: Soft materials, Shape memory polymers and composites, Active composites and devices by 3D printing

Pillar / Cluster: Digital Manufacturing and Design Center, Science and Math Cluster

  • Ge Q., Qi H. J., and Dunn M. L., “Active Materials by 4D Printing”, Applied Physics Letters, in press.
  • Ge Q., Yu K., Dunn M. L., and Qi H. J., “Shape Memory Polymers: Mechanisms and Constitutive Models”, International Journal of Aerospace and Lightweight Structures, in press.
  • Ge Q., Westbrook K. K., Mather P. T., Dunn M. L. and Qi H. J., “Thermomechanical behavior of a two-way shape memory composite actuator”, Smart Materials and Structures, 2013, 22: 055009.
  • Ge Q., Luo, X., Iversen, C. B., Mather P., Dunn M. L. and Qi H. J., “Mechanisms of Triple-Shape Polymeric Composites Featuring Dual Thermal Transitions”, Soft Matter, 2013, 9, 2212–2223.
  • Ge Q., Yu, K., Ding, Y. and Qi, H. J., “Prediction of Temperature Dependent Free Recovery Behaviors of Amorphous Shape Memory Polymers”, Soft Matter, 2012, 8: 11098–11105.
  • Ge Q., Luo X., Rodriguez E. D., Zhang X., Mather P. T., Dunn M. L. and Qi H. J., “Thermo-mechanical Behaviors of Shape Memory Elastomer Composites”, Journal of the Mechanics and Physics of Solids, 2012, 60(1): 67-83.
  • Wang Z. , Hansen C., Ge Q., Maruf S. H., Ahn D. U., Qi H. J. and Ding Y., “Programmable, Pattern-Memorizing Polymer Surface”, Advanced Materials, 2011, 23: 3669-3673.
  • Westbrook K. K., Mather P. T., Parakh V., Dunn M. L., Ge Q., Lee B. M. and Qi H. J., “Two-way reversible shape memory effects in a free-standing polymer composite”, Smart Materials and Structures, 2011, 20: 065010.
  • Chen L.Y., Ge Q., Qu S., and Jiang J. Z., “Stress-induced softening and hardening in a bulk metallic glass”, Scripta Materialia, 2008, 59: 1210-1213.
  • Chen L. Y., Ge Q., Qu S., Jiang Q. K., Nie X. P. and J. Z. Jiang, “Achieving large macroscopic compressive plastic deformation and work-hardening-like behavior in a monolithic bulk metallic glass by tailoring stress distribution”, Applied Physics Letter 2008, 92: 211905.

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